20/30404083 DC - BS IEC 62047-38. Semiconductor devices. Micro-electromechanical devices. Part 38. Test method for adhesion strength of metal powder paste in MEMS interconnection

20/30404083 DC

BS IEC 62047-38. Semiconductor devices. Micro-electromechanical devices. Part 38. Test method for adhesion strength of metal powder paste in MEMS interconnection

Status : Current, Draft for public comment   Published : February 2020

Format
PDF

Format
HARDCOPY






Standard Number20/30404083 DC
TitleBS IEC 62047-38. Semiconductor devices. Micro-electromechanical devices. Part 38. Test method for adhesion strength of metal powder paste in MEMS interconnection
StatusCurrent, Draft for public comment
Publication Date13 February 2020
Normative References(Required to achieve compliance to this standard)IEC 62047-2:2006, IEC 62047-3:2006
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsIEC 62047-38 Ed.1.0
Draft Expiry Date04 November 2020
DescriptorsVocabulary, Electromechanical devices, Integrated circuits, Terminology, Electronic equipment and components, Semiconductor technology, Semiconductor devices
ICS31.080.99
31.140
CommitteeEPL/47
PublisherBSI
FormatA4
DeliveryYes
Pages13
File Size701 KB
NotesWarning: this draft is not current beyond its expiry date for comments.
Price£20.00


 Your basket
Your basket is empty

Multi-user access to over 3,500 medical device standards, regulations, expert commentaries and other documents


Develop a PAS

Develop a fast-track standardization document in 9-12 months


Tracked Changes

Understand the changes made to a standard with our new Tracked Changes version


Worldwide Standards
We can source any standard from anywhere in the world