| Standard Number | 20/30404083 DC |
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| Title | BS IEC 62047-38. Semiconductor devices. Micro-electromechanical devices. Part 38. Test method for adhesion strength of metal powder paste in MEMS interconnection |
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| Status | Current, Draft for public comment |
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| Publication Date | 13 February 2020 |
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| Normative References(Required to achieve compliance to this standard) | IEC 62047-2:2006, IEC 62047-3:2006 |
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| Informative References(Provided for Information) | No other standards are informatively referenced |
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| International Relationships | IEC 62047-38 Ed.1.0 |
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| Draft Expiry Date | 04 November 2020 |
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| Descriptors | Vocabulary, Electromechanical devices, Integrated circuits, Terminology, Electronic equipment and components, Semiconductor technology, Semiconductor devices |
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| ICS | 31.080.99
31.140
|
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| Committee | EPL/47 |
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| Publisher | BSI |
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| Format | A4 |
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| Delivery | Yes |
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| Pages | 13 |
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| File Size | 701 KB |
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| Notes | Warning: this draft is not current beyond its expiry date for comments. |
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| Price | £20.00 |
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