19/30400493 DC - BS EN IEC 61188-6-2. Printed boards and printed board assemblies. Design and use. Part 6-2. Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

19/30400493 DC

BS EN IEC 61188-6-2. Printed boards and printed board assemblies. Design and use. Part 6-2. Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

Status : Current, Draft for public comment   Published : August 2019

Format
PDF

Format
HARDCOPY






Standard Number19/30400493 DC
TitleBS EN IEC 61188-6-2. Printed boards and printed board assemblies. Design and use. Part 6-2. Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
StatusCurrent, Draft for public comment
Publication Date07 August 2019
Normative References(Required to achieve compliance to this standard)IEC 61188-5-1, IEC 61188-6-1, IEC 61191-2, IEC 61191 (all parts), IEC 60194-2
Informative References(Provided for Information)IEC 61188-5-6, IEC 61188-5-3, IPC-7351C, IEC 61188-5-1, IEC 61188-5-4, IEC 61188-5-2, IEC 61188-5-8, IEC 61188-5-5
International RelationshipsIEC 61188-6-2 Ed.1.0
Draft Expiry Date30 August 2019
DescriptorsIntegrated circuits, Dimensions, Dimensional tolerances, Soldering, Printed-circuit boards, Design, Electronic equipment and components, Printed circuits
ICS31.190
CommitteeEPL/501
PublisherBSI
FormatA4
DeliveryYes
Pages26
File Size882 KB
NotesWarning: this draft is not current beyond its expiry date for comments.
Price£20.00


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