BS EN ISO 9453:2020 - Soft solder alloys. Chemical compositions and forms

BS EN ISO 9453:2020

Soft solder alloys. Chemical compositions and forms

Status : Current   Published : October 2020

Format
PDF

Format
HARDCOPY



This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.




Standard NumberBS EN ISO 9453:2020
TitleSoft solder alloys. Chemical compositions and forms
StatusCurrent
Publication Date13 October 2020
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)ISO 3677, IEC 61190-1-3
ReplacesBS EN ISO 9453:2014
International RelationshipsEN ISO 9453:2020,ISO 9453:2020
Draft Superseded By19/30398273 DC
DescriptorsSilver-containing alloys, Lead-containing alloys, Lead alloys, Cadmium-containing alloys, Shape, Joining materials, Chemical composition, Copper-containing alloys, Solders, Marking, Bismuth-containing alloys, Antimony-containing alloys, Indium-containing alloys, Tin alloys
ICS25.160.50
Title in FrenchAlliages de brasage tendre. Compositions chimiques et formes
Title in GermanWeichlote. Chemische Zusammensetzung und Lieferformen
CommitteeEPL/501
ISBN978 0 539 05475 0
PublisherBSI
FormatA4
DeliveryYes
Pages24
File Size1.444 MB
Price£182.00


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