19/30396945 DC - BS EN IEC 63251. Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress

19/30396945 DC

BS EN IEC 63251. Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress

Status : Current, Draft for public comment   Published : November 2019

Format
PDF

Format
HARDCOPY






Standard Number19/30396945 DC
TitleBS EN IEC 63251. Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress
StatusCurrent, Draft for public comment
Publication Date29 November 2019
Normative References(Required to achieve compliance to this standard)IEC 60068-2-14, IEC 60068-2-78, IEC 60068-2-2, IPC-6012DA:2016, IPC-TM-650-2.6.27
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsIEC 63251 Ed.1.0
Draft Expiry Date22 January 2020
DescriptorsAssessed reliability, Reliability, Stress, Thermal stress, Printed-circuit boards, Test methods
ICS31.180
CommitteeEPL/501
PublisherBSI
FormatA4
DeliveryYes
Pages17
File Size1.666 MB
NotesWarning: this draft is not current beyond its expiry date for comments.
Price£20.00


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