BS EN IEC 60749-15:2020 - Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices

BS EN IEC 60749-15:2020

Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices

Status : Current   Published : October 2020

Format
PDF

Format
HARDCOPY



IEC 60749-15:2020 is available as

IEC 60749-15:2020 RLV

which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.



IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3, Terms and definitions; - clarification of the use of a soldering iron for producing the heating effect; - inclusion an option to use accelerated ageing.




Standard NumberBS EN IEC 60749-15:2020
TitleSemiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices
StatusCurrent
Publication Date01 October 2020
Normative References(Required to achieve compliance to this standard)IEC 60068-2-20, IEC 60749-8, IEC 60749-3, EN 60749-8, EN 60749-3
Informative References(Provided for Information)IEC 60194
ReplacesBS EN 60749-15:2010
International RelationshipsEN IEC 60749-15:2020,IEC 60749-15:2020
Draft Superseded By19/30395803 DC
DescriptorsSemiconductor devices, Slots, Soldering, Climate, Encapsulated, Thermal testing, Holes, Environmental testing, Solderability testing, Integrated circuits, Destructive testing, Electronic equipment and components, Mechanical testing
ICS31.080.01
Title in FrenchDispositifs à semiconducteurs. Méthodes d'essais mécaniques et climatiques Résistance à la température de brasage pour dispositifs par trous traversants
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Prüfverfahren Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage
CommitteeEPL/47
ISBN978 0 539 04937 4
PublisherBSI
FormatA4
DeliveryYes
Pages16
File Size0.9932 MB
Price£134.00


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