19/30395803 DC - BS EN 60749-15. Semiconductor devices. Mechanical and climatic test methods. Part 15. Resistance to soldering temperature for through-hole mounted devices

19/30395803 DC

BS EN 60749-15. Semiconductor devices. Mechanical and climatic test methods. Part 15. Resistance to soldering temperature for through-hole mounted devices

Status : Draft for public comment, Current   Published : July 2019

Format
PDF

Format
HARDCOPY






Standard Number19/30395803 DC
TitleBS EN 60749-15. Semiconductor devices. Mechanical and climatic test methods. Part 15. Resistance to soldering temperature for through-hole mounted devices
StatusDraft for public comment, Current
Publication Date10 July 2019
Normative References(Required to achieve compliance to this standard)IEC 60194, IEC 60749-3, IEC 60749-8, IEC 60068-2-20
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsIEC 60749-15 Ed.3.0
Draft Expiry Date27 August 2019
DescriptorsDestructive testing, Thermal testing, Climate, Encapsulated, Semiconductor devices, Electronic equipment and components, Solderability testing, Soldering, Integrated circuits, Mechanical testing, Environmental testing, Holes, Slots
ICS31.080.01
Title in FrenchIEC 60749-15 ED3: Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 15:
CommitteeEPL/47
PublisherBSI
FormatA4
DeliveryYes
Pages10
File Size289 KB
NotesWarning: this draft is not current beyond its expiry date for comments.
Price£20.00


 Your basket
Your basket is empty

Multi-user access to over 3,500 medical device standards, regulations, expert commentaries and other documents


Worldwide Standards
We can source any standard from anywhere in the world


Develop a PAS

Develop a fast-track standardization document in 9-12 months


BSOL

The faster, easier way to work with standards