19/30394489 DC - BS EN 61760-3. Surface mounting technology. Part 3. Standard method for the specification of components for through hole reflow (THR) soldering

19/30394489 DC

BS EN 61760-3. Surface mounting technology. Part 3. Standard method for the specification of components for through hole reflow (THR) soldering

Status : Current, Draft for public comment   Published : July 2019

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Standard Number19/30394489 DC
TitleBS EN 61760-3. Surface mounting technology. Part 3. Standard method for the specification of components for through hole reflow (THR) soldering
StatusCurrent, Draft for public comment
Publication Date16 July 2019
Normative References(Required to achieve compliance to this standard)IEC 60194, IEC 60068-2-77, IEC 61760-2, IEC 61191-3, IEC 60286-4, IEC 60286, IPC-A-610F, IEC 62090, IEC 60068-2-58, IEC 60749-20, IEC 60068, IEC 61760-1, IEC 61188-6-4, IEC 60068-2-21, IEC 60286-5, IEC 60286-3, IEC 60068-2-20:2008, IEC 60068-2-45:1980, IEC 61760-4:2015
Informative References(Provided for Information)IEC 60068-2-82, IEC 60326-5:1980
International RelationshipsIEC 61760-3 Ed.2.0
Draft Expiry Date06 August 2019
DescriptorsSoldering, Integrated circuits, Cleaning, Marking, Electrical components, Electronic equipment and components, Microassembling, Packaging, Solderability testing, Holes, Integrated circuit technology, Surface mounting devices
ICS31.190
Title in FrenchIEC 61760-3 ED2: Technique du montage en surface - Partie 3 :
CommitteeEPL/501
PublisherBSI
FormatA4
DeliveryYes
Pages34
File Size857 KB
NotesWarning: this draft is not current beyond its expiry date for comments.
Price£20.00


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