BS EN IEC 60749-30:2020 - Semiconductor devices. Mechanical and climatic test methods. Preconditioning of non-hermetic surface mount devices prior to reliability testing

BS EN IEC 60749-30:2020

Semiconductor devices. Mechanical and climatic test methods. Preconditioning of non-hermetic surface mount devices prior to reliability testing

Status : Current   Published : September 2020

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IEC 60749-30:2020 is available as

IEC 60749-30:2020 RLV

which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.



IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3; - expansion of 6.7 on solder reflow; - inclusion of explanatory notes and clarifications.




Standard NumberBS EN IEC 60749-30:2020
TitleSemiconductor devices. Mechanical and climatic test methods. Preconditioning of non-hermetic surface mount devices prior to reliability testing
StatusCurrent
Publication Date30 September 2020
Normative References(Required to achieve compliance to this standard)IEC 60749-11, EN 60749-4, EN 60749-11, IEC 60749-33, IEC 60749-4, EN 60749-24, FprEN 60749-20:2020, EN 60749-33, IEC 60749-5, EN 60749-5, IEC 60749-24, IEC 60749-20:2020, EN 60749-25:2003, IEC 60749-25:2003, IEC 60749-20-1:2019
Informative References(Provided for Information)No other standards are informatively referenced
ReplacesBS EN 60749-30:2005+A1:2011
International RelationshipsEN IEC 60749-30:2020,IEC 60749-30:2020
Draft Superseded By19/30394481 DC
DescriptorsSemiconductor devices, Surface mounting devices, Electronic equipment and components, Environmental testing, Reliability, Specimen preparation, Performance testing, Integrated circuits, Climate, Mechanical testing
ICS31.080.01
Title in FrenchDispositifs à semiconducteurs. Méthodes d'essais mécaniques et climatiques Préconditionnement des composants pour montage en surface non hermétiques avant les essais de fiabilité
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Prüfverfahren Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor Zuverlässigkeitsprüfungen
CommitteeEPL/47
ISBN978 0 539 04583 3
PublisherBSI
FormatA4
DeliveryYes
Pages18
File Size1.014 MB
Price£134.00


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