PD IEC TR 62878-2-7:2019 Device embedding assembly technology. Guidelines. Accelerated stress testing of passive embedded circuit boards

PD IEC TR 62878-2-7:2019

Device embedding assembly technology. Guidelines. Accelerated stress testing of passive embedded circuit boards

Status : Current   Published : April 2019

Format
PDF

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HARDCOPY



What is this standard about?

This part of IEC 62878 describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.




Standard NumberPD IEC TR 62878-2-7:2019
TitleDevice embedding assembly technology. Guidelines. Accelerated stress testing of passive embedded circuit boards
StatusCurrent
Publication Date01 April 2019
Normative References(Required to achieve compliance to this standard)IEC 60194
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsIEC TR 62878-2-7:2019
DescriptorsCircuits, Boards, Testing, Stress, Assembly
ICS31.180
31.190
CommitteeEPL/501
ISBN978 0 539 03359 5
PublisherBSI
FormatA4
DeliveryYes
Pages16
File Size2.474 MB
Price£130.00


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