PD IEC TR 60286-7:2019 - Packaging of components for automatic handling. Introduction of a bulk blister pack for miniaturized components

PD IEC TR 60286-7:2019

Packaging of components for automatic handling. Introduction of a bulk blister pack for miniaturized components

Status : Current   Published : October 2019

Format
PDF

Format
HARDCOPY



IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.




Standard NumberPD IEC TR 60286-7:2019
TitlePackaging of components for automatic handling. Introduction of a bulk blister pack for miniaturized components
StatusCurrent
Publication Date29 October 2019
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)IEC 60286-3:2019, IEC 61340-5-3:2015, IEC 62090:2017, IEC 61340-5-1:2016
International RelationshipsIEC TR 60286-7:2019
DescriptorsDimensions, Adhesive strength, Packages, Materials handling components, Components
ICS31.020
31.240
Title in FrenchEmballage de composants pour opérations automatisées Introduction d’une plaquette thermoformée en volume pour des composants miniaturisés
CommitteeEPL/40X
ISBN978 0 539 03266 6
PublisherBSI
FormatA4
DeliveryYes
Pages16
File Size1.93 MB
Price£130.00


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