| Standard Number | 18/30380157 DC |
|---|
| Title | BS IEC 61189-5-601. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-601. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards |
|---|
| Status | Current, Draft for public comment |
|---|
| Publication Date | 29 June 2018 |
|---|
| Normative References(Required to achieve compliance to this standard) | IEC 60068-2-58, IEC 60068-2-14:2009, IEC 62137-4:2014, IEC 62137-1-1:2007, IEC 61189-5-3:2015, IEC 60068-2-78:2012, IEC 61249-2-7:2002, IEC 61190-1-2:2007, IEC 60191-6-19:2010, IEC 61188-5-8:2007, IEC 61190-1-2:2014, IEC 60191-6-5:2001, IEC 62137-3:2011, IEC 60191-6-2:2001, IEC 61249-2-8:2003, IEC 61190-1-3:2007/AMD1:2010, IEC 60068-2-66:1994, IEC 61190-1-1:2002, IEC 61760-1:2006 |
|---|
| Informative References(Provided for Information) | No other standards are informatively referenced |
|---|
| International Relationships | IEC 61189-5-601 Ed1.0 |
|---|
| Draft Expiry Date | 06 November 2019 |
|---|
| Descriptors | Electrical equipment, Testing, Resistance (electrical), Heat resistance, Printing board |
|---|
| ICS | 19.080
|
|---|
| Committee | EPL/501 |
|---|
| Publisher | BSI |
|---|
| Format | A4 |
|---|
| Delivery | Yes |
|---|
| Pages | 34 |
|---|
| File Size | 793 KB |
|---|
| Notes | Warning: this draft is not current beyond its expiry date for comments. |
|---|
| Price | £20.00 |
|---|
