18/30380157 DC - BS IEC 61189-5-601. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-601. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

18/30380157 DC

BS IEC 61189-5-601. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-601. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Status : Current, Draft for public comment   Published : June 2018

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Standard Number18/30380157 DC
TitleBS IEC 61189-5-601. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-601. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
StatusCurrent, Draft for public comment
Publication Date29 June 2018
Normative References(Required to achieve compliance to this standard)IEC 60068-2-58, IEC 60068-2-14:2009, IEC 62137-4:2014, IEC 62137-1-1:2007, IEC 61189-5-3:2015, IEC 60068-2-78:2012, IEC 61249-2-7:2002, IEC 61190-1-2:2007, IEC 60191-6-19:2010, IEC 61188-5-8:2007, IEC 61190-1-2:2014, IEC 60191-6-5:2001, IEC 62137-3:2011, IEC 60191-6-2:2001, IEC 61249-2-8:2003, IEC 61190-1-3:2007/AMD1:2010, IEC 60068-2-66:1994, IEC 61190-1-1:2002, IEC 61760-1:2006
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsIEC 61189-5-601 Ed1.0
Draft Expiry Date06 November 2019
DescriptorsElectrical equipment, Testing, Resistance (electrical), Heat resistance, Printing board
ICS19.080
CommitteeEPL/501
PublisherBSI
FormatA4
DeliveryYes
Pages34
File Size793 KB
NotesWarning: this draft is not current beyond its expiry date for comments.
Price£20.00


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