ASTM F487 - 13(2018) - Standard Specification for Fine Aluminum-1 % Silicon Wire for Semiconductor Lead-Bonding

ASTM F487 - 13(2018)

Standard Specification for Fine Aluminum-1 % Silicon Wire for Semiconductor Lead-Bonding

Status : Current   Published : March 2018

Format
PDF

Format
HARDCOPY



1.1 This specification covers aluminum–1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters larger than 76 μm (0.003 in.), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in SI units are to be regarded as the standard, regardless of whether they appear first or second in a table. Values given in parentheses are for information only.

1.3  This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.




Standard NumberASTM F487 - 13(2018)
TitleStandard Specification for Fine Aluminum-1 % Silicon Wire for Semiconductor Lead-Bonding
StatusCurrent
Publication Date01 March 2018
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
Descriptors Silicon aluminum wire, wire bonding
ICS29.060.10
PublisherASTM
FormatA4
DeliveryYes
Pages4
File Size96 KB
Price£36.00


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