18/30375624 DC - BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods. Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

18/30375624 DC

BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods. Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Status : Current, Draft for public comment   Published : July 2018

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Standard Number18/30375624 DC
TitleBS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods. Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
StatusCurrent, Draft for public comment
Publication Date13 July 2018
Normative References(Required to achieve compliance to this standard)IEC 60749-30, IEC 60749-20
Informative References(Provided for Information)IEC 60749-37, IEC 60749-39, IPC/JEDEC J-STD-033
International RelationshipsIEC 60749-20-1 Ed.2.0
Draft Expiry Date29 August 2018
DescriptorsSemiconductor devices, Transportation, Thermal testing, Labelling (process), Soldering, Integrated circuits, Electronic equipment and components, Surface mounting devices, Mechanical testing, Packaging, Environmental testing, Environment (working), Damp-heat tests, Materials handling, Climate
ICS31.080.01
CommitteeEPL/47
PublisherBSI
FormatA4
DeliveryYes
Pages39
File Size625 KB
NotesWarning: this draft is not current beyond its expiry date for comments.
Price£20.00


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