18/30375624 DC

BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods. Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Status : Current, Draft for public comment Published : July 2018

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HARDCOPY

Standard Number	18/30375624 DC
Title	BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods. Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Status	Current, Draft for public comment
Publication Date	13 July 2018
Normative References(Required to achieve compliance to this standard)	IEC 60749-30, IEC 60749-20
Informative References(Provided for Information)	IEC 60749-37, IEC 60749-39, IPC/JEDEC J-STD-033
International Relationships	IEC 60749-20-1 Ed.2.0
Draft Expiry Date	29 August 2018
Descriptors	Semiconductor devices, Transportation, Thermal testing, Labelling (process), Soldering, Integrated circuits, Electronic equipment and components, Surface mounting devices, Mechanical testing, Packaging, Environmental testing, Environment (working), Damp-heat tests, Materials handling, Climate
ICS	31.080.01
Committee	EPL/47
Publisher	BSI
Format	A4
Delivery	Yes
Pages	39
File Size	625 KB
Notes	Warning: this draft is not current beyond its expiry date for comments.
Price	£20.00

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