BS EN 16602-70-38:2019 Space product assurance. High-reliability soldering for surface-mount and mixed technology

BS EN 16602-70-38:2019

Space product assurance. High-reliability soldering for surface-mount and mixed technology

Status : Under review, Current   Published : May 2019



What is this standard about?

This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixed technology.

The Standard defines acceptance and rejection criteria for high-reliability manufacture of surface-mount and mixed-technology circuit assemblies intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight.

The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work.

The assembly of leaded devices to through-hole terminations and general soldering principles are covered in ECSS-Q-ST-70-08. 

Requirements related to printed circuit boards are contained in ECSS-Q-ST70-10, ECSS-Q-ST-70-11 and ECSS-Q-ST-70-12 . The mounting and supporting of devices, terminals and conductors prescribed herein applies to assemblies at PCB level designed to continuously operate over the mission within the temperature limits of -55 °C to +85 °C.

For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability.

Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 °C, power transistors) in order to ensure that solder joints do not exceed 85 °C.

Verification of SMD assembly processes is made on test vehicles (surface mount verification samples). Temperature cycling ensures the operational lifetime for spacecraft. However, mechanical testing only indicates SMD reliability as it is unlikely that the test vehicle represents every flight configuration.

This Standard does not cover the qualification and acceptance of the EQM and FM equipment with surface-mount and mixed-technology.

The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST-10-03.

Standard NumberBS EN 16602-70-38:2019
TitleSpace product assurance. High-reliability soldering for surface-mount and mixed technology
StatusUnder review, Current
Publication Date03 May 2019
Normative References(Required to achieve compliance to this standard)EN 16602-10-09, EN 16602-60, ECSS-Q-ST-70-11, EN 16601-00-01, ECSS-Q-ST-10-09, ECSS-Q-ST-70-02, ECSS-S-ST-00-01, EN 16601-40, EN 16602-70-11, EN 16602-70, EN 16602-70-10, EN 16602-60-05, ECSS-Q-ST-60-05, ECSS-Q-ST-70-12, MIL-STD-883 Method 2009, ECSS-Q-ST-70-01, ECSS-Q-ST-70-28, EN 16602-70-12, ECSS-Q-ST-70-08, EN 16602-70-71, EN 16602-70-02, ECSS-Q-ST-20, ECSS-Q-ST-70-71, EN 16602-20, ECSS-Q-ST-70, ECSS-M-ST-40, ECSS-Q-ST-70-10, EN 16602-60-13, ECSS-Q-ST-60, ECSS-Q-ST-60-13, EN 16602-70-28, EN 16602-70-08, EN 16602-70-01
Informative References(Provided for Information)EN 61190-1-2:2014, EN 16601-00, EN 16603-10-02, ESA SP-1173, ECSS-E-HB-32-25, ECSS-E-HB-20-05, EN 61190-1-1:2002, ESA STM-265, ECSS-E-ST-10-03, ECSS-S-ST-00
International RelationshipsEN 16602-70-38:2019
DescriptorsProduct design, Production management, Quality assurance, Space technology, Quality management, Air transport, Design, Consumer-supplier relations, Project management, Production planning, Aerospace transport, Space transport, Quality control
Title in FrenchAssurance produit des projets spatiaux. Soudure haute fiabilité pour technologies à montage de surface et mixte
Title in GermanRaumfahrtproduktsicherung. Hochzuverlässiges Löten von Oberflächen-Befestigungen und gemischte Technologien
ISBN978 0 539 00395 6
File Size5.499 MB

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