19/30364443 DC - BS EN IEC 62047-35. Semiconductor devices. Micro-electromechanical devices. Part 35. Test method of electrical characteristics under bending deformation for flexible and foldable electro-mechanical devices

19/30364443 DC

BS EN IEC 62047-35. Semiconductor devices. Micro-electromechanical devices. Part 35. Test method of electrical characteristics under bending deformation for flexible and foldable electro-mechanical devices

Status : Current, Draft for public comment   Published : January 2019

Format
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Format
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Standard Number19/30364443 DC
TitleBS EN IEC 62047-35. Semiconductor devices. Micro-electromechanical devices. Part 35. Test method of electrical characteristics under bending deformation for flexible and foldable electro-mechanical devices
StatusCurrent, Draft for public comment
Publication Date04 January 2019
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsFprEN IEC 62047-35:2019,IEC 62047-35:2019
Draft Expiry Date13 February 2019
DescriptorsSemiconductor technology, Electromechanical devices, Deformation, Test methods, Semiconductor devices
ICS31.080.99
Title in FrenchIEC 62047-35 ED1: Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 35 :
CommitteeEPL/47
PublisherBSI
FormatA4
DeliveryYes
Pages19
File Size494 KB
NotesWarning: this draft is not current beyond its expiry date for comments.
Price£20.00


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