| Standard Number | 19/30364443 DC |
|---|
| Title | BS EN IEC 62047-35. Semiconductor devices. Micro-electromechanical devices. Part 35. Test method of electrical characteristics under bending deformation for flexible and foldable electro-mechanical devices |
|---|
| Status | Current, Draft for public comment |
|---|
| Publication Date | 04 January 2019 |
|---|
| Normative References(Required to achieve compliance to this standard) | No other standards are normatively referenced |
|---|
| Informative References(Provided for Information) | No other standards are informatively referenced |
|---|
| International Relationships | FprEN IEC 62047-35:2019,IEC 62047-35:2019 |
|---|
| Draft Expiry Date | 13 February 2019 |
|---|
| Descriptors | Semiconductor technology, Electromechanical devices, Deformation, Test methods, Semiconductor devices |
|---|
| ICS | 31.080.99
|
|---|
| Title in French | IEC 62047-35 ED1: Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 35 : |
|---|
| Committee | EPL/47 |
|---|
| Publisher | BSI |
|---|
| Format | A4 |
|---|
| Delivery | Yes |
|---|
| Pages | 19 |
|---|
| File Size | 494 KB |
|---|
| Notes | Warning: this draft is not current beyond its expiry date for comments. |
|---|
| Price | £20.00 |
|---|
