BS EN IEC 61249-2-45:2018 - Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

BS EN IEC 61249-2-45:2018

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Status : Current   Published : April 2018

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IEC 61249-2-45:2018(E) gives requirements for properties of non-halogenated epoxide non?woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Thermal conductivity is defined to be (1,0 ± 0,15) W/(m•K ).




Standard NumberBS EN IEC 61249-2-45:2018
TitleMaterials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
StatusCurrent
Publication Date13 April 2018
Normative References(Required to achieve compliance to this standard)EN 61189-2:2006, IEC 61189-2:2006, EN 61249-5-1, ISO 11014, IEC 61249-5-1, IEC/PAS 61249-6-3
Informative References(Provided for Information)IEC 60194:2015, ISO 9000, ISO 14001, EN ISO 9000, EN ISO 14001
International RelationshipsEN IEC 61249-2-45:2018,IEC 61249-2-45:2018
Draft Superseded By18/30363347 DC
DescriptorsPrinted-circuit boards, Reinforced materials, Flammability, Conductivity (thermal), Printed circuits
ICS31.180
Title in FrenchMatériaux pour circuits imprimés et autres structures d'interconnexion Matériaux de base renforcés, plaqués et non plaqués. Feuilles stratifiées renforcées en verre de type E tissé/non tissé époxyde non halogéné, plaquées cuivre de conductivité thermique (1,0W/m m K) et d'inflammabilité définie (essai de combustion verticale) pour les assemblages sans plomb
Title in GermanMaterialien für Leiterplatten und andere Verbindungsstrukturen Kaschierte und unkaschierte verstärkte Basismaterialien. Kupferkaschierte, mit E-Glaswirrfaser im Kernbereich und E-Glasgewebe in den Außenlagen verstärkte Laminattafeln auf der Basis von halogenfreiem Epoxidharz mit Wärmeleitfähigkeit (1,0 W/m K) und definierter Brennbarkeit (vertikale Prüflingslage) für bleifreie Bestückungstechnik
CommitteeEPL/501
ISBN978 0 580 99199 8
PublisherBSI
FormatA4
DeliveryYes
Pages28
File Size1.088 MB
Price£182.00


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