BS IEC 63011-2:2018

BS IEC 63011-2:2018

Integrated circuits. Three dimensional integrated circuits. Alignment of stacked dies having fine pitch interconnect

Status : Current   Published : January 2019

Format
PDF

Format
HARDCOPY



What is this standard about?

This part of IEC 63011 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.




Standard NumberBS IEC 63011-2:2018
TitleIntegrated circuits. Three dimensional integrated circuits. Alignment of stacked dies having fine pitch interconnect
StatusCurrent
Publication Date24 January 2019
Normative References(Required to achieve compliance to this standard)IEC 63011-1
Informative References(Provided for Information)IEC 63011-3
International RelationshipsIEC 63011-2:2018
Draft Superseded By17/30355726 DC
DescriptorsTest equipment, Impulse-voltage tests, Electrical measurement, Impulse voltages, Electronic equipment and components, Semiconductors, Integrated circuits, Electromagnetic compatibility, Transient voltages
ICS31.200
Title in FrenchCircuits intégrés. Circuits intégrés tridimensionnels Alignement de puces empilées à petits pas d'interconnexion
CommitteeEPL/47
ISBN978 0 580 97375 8
PublisherBSI
FormatA4
DeliveryYes
Pages18
File Size1.035 MB
Price£130.00


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