PD IEC/TS 62647-4:2018 - Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Ball grid array (BGA) re-balling

PD IEC/TS 62647-4:2018

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Ball grid array (BGA) re-balling

Status : Current   Published : April 2018

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IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.




Standard NumberPD IEC/TS 62647-4:2018
TitleProcess management for avionics. Aerospace and defence electronic systems containing lead-free solder. Ball grid array (BGA) re-balling
StatusCurrent
Publication Date25 April 2018
Normative References(Required to achieve compliance to this standard)IEC 62668, IEC TR 61340-5-2, JEDEC JESD625, IPC J-STD-004, IPC-TM-650 number 2.3.25, ECA/IPC/JEDEC J-STD-075, JEDEC JESD22-B117, IPC J-STD-005, IPC/JEDEC J-STD-020, IPC/JEDEC J-STD-033, JEDEC JESD22-B107, AEC-Q100-010, ANSI/ESD S20.20, IEC 62090, IPC J-STD-002, JEDEC JESD22-B101, IPC J-STD-001xS, IPC J-STD-001, MIL-STD-883, IPC/JEDEC J-STD-035, SAE AS5553, JEDEC JESD213, JEDEC JESD22-A101, IEC 61340-5-1, JEDEC J-STD-046
Informative References(Provided for Information)IEC/TS 62647-21 Ed.1.0, IEC/TS 62668-1 Ed.3.0, IEC/TS 62647-2 Ed.1.0, IEC/TS 62647-22 Ed.1.0, IEC TS 62647-3:2014, EIA-STD-4899,

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