BS EN IEC 61189-2-630:2018 - Test methods for electrical materials, printed board and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning

BS EN IEC 61189-2-630:2018

Test methods for electrical materials, printed board and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning

Status : Current   Published : October 2018

Format
PDF

Format
HARDCOPY



IEC 61189-2-630:2018 specifies a test method to determine the amount of water absorbed by metal-clad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.




Standard NumberBS EN IEC 61189-2-630:2018
TitleTest methods for electrical materials, printed board and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning
StatusCurrent
Publication Date10 October 2018
Normative References(Required to achieve compliance to this standard)IEC 60194
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 61784-3-1:2010,EN IEC 61189-2-630:2018,IEC 61189-2-630:2018
Draft Superseded By17/30355504 DC
DescriptorsElectric arcs, Resistance measurement, Printed-circuit boards, Electronic equipment and components, Impregnated materials, Electrical resistivity, Compressible flow, Determination of content, Plastics, High-temperature testing, Time, Testing conditions, Electrodes, Flow measurement, Electrical testing, Peeling tests, Position, Volatile matter determination, Blistering, Sodium hydroxide, Pull-out tests, Thermal-shock tests, Test equipment, Chemical analysis and testing, Thermal testing, Cleaning, Printed circuits, Precision, Gelation, Test specimens, Electrical insulating materials, Chemical-resistance tests, Accuracy
ICS31.180
Title in FrenchMéthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles Méthodes d'essai des matériaux pour structures d'interconnexion. Absorption d'humidité après conditionnement dans un récipient sous pression
Title in GermanPrüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen Prüfverfahren für Materialien für Verbindungsstrukturen. Feuchteaufnahme nach Druckbehälterbeanspruchung
CommitteeEPL/501
ISBN978 0 580 97309 3
PublisherBSI
FormatA4
DeliveryYes
Pages14
File Size929 KB
Price£110.00


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