BS EN IEC 62878-1:2019 - Device embedding assembly technology. Generic specification for device embedded substrates

BS EN IEC 62878-1:2019

Device embedding assembly technology. Generic specification for device embedded substrates

Status : Current   Published : December 2019

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IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.


This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.


The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.




Standard NumberBS EN IEC 62878-1:2019
TitleDevice embedding assembly technology. Generic specification for device embedded substrates
StatusCurrent
Publication Date17 December 2019
Normative References(Required to achieve compliance to this standard)EN 60068-2-27, IEC TS 62878-2-4, IEC 60068-2-69, EN 61760-4, EN 60068-2-2, IEC 60068-2-6, J-STD 033, EN 62137-1-4, IEC 60068-2-27, IEC/TS 62878-2-3, IEC/TS 62878-2-1, IEC 60068-2-78, EN 60068-2-78, IEC 60068-2-21, IEC/TS 62878-2-4, IEC 60068-2-2, IEC 61760-4, IEC TS 62878-2-3, EN 60068-2-14, IEC 62878-1-1, IEC 60068-2-1, IEC 60194-2, IEC 61340-5-1, IEC 61340-5-3, IEC TS 62878-2-1, EN 60068-2-6, EN 60068-2-21, EN 61340-5-3, IEC/TR 62878-2-2, IEC 60068-2-14, EN 61340-5-1, IEC TR 62878-2-2, IEC 62137-1-4, EN 60068-2-1, EN 60068-2-69
Informative References(Provided for Information)EN 60068-1:2014, IEC 60068-1:2013, IEC TR 61340-5-2, CLC/TR 61340-5-2, IEC 60068-2-45, IEC/TR 61340-5-2, EN 60068-2-58, JPCA-EB01, EN 60068-2-45, IEC 62421, IPC 7092, IEC 60068-2-58, EN 62421
International RelationshipsEN IEC 62878-1:2019,IEC 62878-1:2019
Draft Superseded By18/30355486 DC
DescriptorsComponents, Substrates (insulating), Structures, Electric connectors, Electronic equipment and components
ICS31.180
31.190
Title in FrenchTechniques d’assemblage avec appareil(s) integre(s) Spécification générique pour substrats avec appareil(s) intégré(s)
Title in GermanMontageverfahren für eingebettete Bauteile Fachgrundspezifikation für Trägermaterial mit eingebetteten Bauteilen
CommitteeEPL/501
ISBN978 0 580 97304 8
PublisherBSI
FormatA4
DeliveryYes
Pages26
File Size1.101 MB
Price£182.00


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