BS EN IEC 62148-19:2019 - Fibre optic active components and devices. Package and interface standards. Photonic chip scale package

BS EN IEC 62148-19:2019

Fibre optic active components and devices. Package and interface standards. Photonic chip scale package

Status : Current   Published : July 2019

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PDF

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HARDCOPY



IEC 62148-19: 2019 covers the photonic chip scale package. The purpose of this document is to specify adequately the physical requirements of optical transmitters and receivers that will enable mechanical interchangeability of transmitters and receivers.


Keywords: physical interface for photonic chip scale packages




Standard NumberBS EN IEC 62148-19:2019
TitleFibre optic active components and devices. Package and interface standards. Photonic chip scale package
StatusCurrent
Publication Date12 July 2019
Normative References(Required to achieve compliance to this standard)IEC 62148-1, EN IEC 62148-1
Informative References(Provided for Information)EN IEC 62148-21, IEC 60191, IEC 61281-1, IEC 60191 (all parts), EN 60191, EN IEC 61281-1, IEC 62148-21
International RelationshipsEN IEC 62148-19:2019,IEC 62148-19:2019
Draft Superseded By18/30353741 DC
DescriptorsInterchangeability, Telecommunication, Fibre optics, Optical fibres, Fibre optic connectors, Interfaces
ICS33.180.20
Title in FrenchComposants et dispositifs actifs fibroniques. Normes de boîtier et d'interface Boîtier à puce photonique
Title in GermanAktive Lichtwellenleiterbauelemente und -geräte. Gehäuse- und Schnittstellennormen Photonisches Gehäuse in Chipgröße
CommitteeGEL/86/3
ISBN978 0 580 96883 9
PublisherBSI
FormatA4
DeliveryYes
Pages44
File Size3.941 MB
Price£214.00


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