BS IEC 62047-31:2019 Semiconductor devices. Micro-electromechanical devices. Four-point bending test method for interfacial adhesion energy of layered MEMS materials

BS IEC 62047-31:2019

Semiconductor devices. Micro-electromechanical devices. Four-point bending test method for interfacial adhesion energy of layered MEMS materials

Status : Current   Published : April 2019

Format
PDF

Format
HARDCOPY



What is this standard about?

This part of IEC 62047 specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS) based on the concept of fracture mechanics. In a variety of MEMS devices, there are many layered material interfaces, and their adhesion energies are critical to the reliability of the MEMS devices. The four-point bending test utilizes a pure bending moment applied to a test piece of layered MEMS device, and the interfacial adhesion energy is measured from the critical bending moment for the steady state cracking in the weakest interface. This test method applies to MEMS devices with thin film layers deposited on semiconductor substrates. The total thickness of the thin film layers should be 100 times less than the thickness of a supporting substrate (typically a silicon wafer piece).




Standard NumberBS IEC 62047-31:2019
TitleSemiconductor devices. Micro-electromechanical devices. Four-point bending test method for interfacial adhesion energy of layered MEMS materials
StatusCurrent
Publication Date17 April 2019
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)IEC 62047-2:2006, IEC 62047-3:2006
International RelationshipsERROR,IEC 62047-31:2019
Draft Superseded By17/30352696 DC
DescriptorsOptical disks, Storage, Coding (data conversion), Environment (working), Error correction, Defects, Dimensions, Data transfer, Recording characteristics, Optical properties of materials, Testing conditions, Data recording, Digital signals, Data layout, Read-only storage, Computer storage devices, Data transmission, Recording tracks, Data processing, Information exchange, Data media, Optical recording, CD-ROM
ICS31.080.99
CommitteeEPL/47
ISBN978 0 580 96660 6
PublisherBSI
FormatA4
DeliveryYes
Pages16
File Size1.499 MB
Price£130.00


 Your basket
Your basket is empty

Multi-user access to over 3,500 medical device standards, regulations, expert commentaries and other documents


Tracked Changes

Understand the changes made to a standard with our new Tracked Changes version


Worldwide Standards
We can source any standard from anywhere in the world


BSOL

The faster, easier way to work with standards