BS IEC 62899-202-5:2018 - Printed electronics. Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate

BS IEC 62899-202-5:2018

Printed electronics. Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate

Status : Current   Published : October 2018

Format
PDF

Format
HARDCOPY



IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.

 




Standard NumberBS IEC 62899-202-5:2018
TitlePrinted electronics. Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
StatusCurrent
Publication Date09 October 2018
Normative References(Required to achieve compliance to this standard)IEC 62899-202:2016
Informative References(Provided for Information)IEC 62899-502-1:2017, IEC 62715-6-1, IEC 62899-201, ISO 527-3, IEC 62951-1
International RelationshipsIEC 62899-202-5:2018
Draft Superseded By18/30352656 DC
DescriptorsElectric insulators, Electrical insulation devices, Electronic engineering, Electronic equipment and components, Electrical components, Electrical insulating materials, Test methods, Printed-circuit boards, Electrical insulation, Conductive inks, Inks
ICS31.180
87.080
CommitteeAMT/9
ISBN978 0 580 96621 7
PublisherBSI
FormatA4
DeliveryYes
Pages18
File Size1.366 MB
Price£130.00


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