BS EN IEC 62878-2-5:2019 - Device embedding assembly technology. Guidelines. Implementation of a 3D data format for device embedded substrate

BS EN IEC 62878-2-5:2019

Device embedding assembly technology. Guidelines. Implementation of a 3D data format for device embedded substrate

Status : Current   Published : November 2019

Format
PDF

Format
HARDCOPY



IEC 62878-2-5:2019(E) specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.


This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.


IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.




Standard NumberBS EN IEC 62878-2-5:2019
TitleDevice embedding assembly technology. Guidelines. Implementation of a 3D data format for device embedded substrate
StatusCurrent
Publication Date18 November 2019
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)IEC TR 62878-2-2:2015, PD IEC/PAS 62878-2-5:2015, IEC TS 62878-2-1:2015, IEC 60194:2015, IEC 62878-1-1:2015, IEC TS 62878-2-3:2015, IEC TS 62878-2-4:2015
ReplacesPD IEC/PAS 62878-2-5:2015
International RelationshipsEN IEC 62878-2-5:2019,IEC 62878-2-5:2019
Draft Superseded By18/30352619 DC
DescriptorsStructures, Substrates (insulating), Electronic equipment and components, Components, Electric connectors
ICS31.180
31.190
Title in FrenchTechniques d’assemblage avec intégration d’appareils Lignes directrices. Mise en oeuvre d’un format de données 3D pour un substrat avec appareils intégrés
Title in GermanMontageverfahren für eingebettete Bauteile Implementierung eines 3D-Datenformats für Trägermaterial mit eingebetteten Bauteilen
CommitteeEPL/501
ISBN978 0 580 96583 8
PublisherBSI
FormatA4
DeliveryYes
Pages58
File Size5.34 MB
Price£254.00


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