BS EN IEC 60749-41:2020 - Semiconductor devices. Mechanical and climatic test methods. Standard reliability testing methods of non-volatile memory devices

BS EN IEC 60749-41:2020

Semiconductor devices. Mechanical and climatic test methods. Standard reliability testing methods of non-volatile memory devices

Status : Current   Published : September 2020

Format
PDF

Format
HARDCOPY



IEC 60749-41:2020 specifies the procedural requirements for performing valid endurance, retention and cross-temperature tests based on a qualification specification. Endurance and retention qualification specifications (for cycle counts, durations, temperatures, and sample sizes) are specified in JESD47 or are developed using knowledge-based methods such as in JESD94.




Standard NumberBS EN IEC 60749-41:2020
TitleSemiconductor devices. Mechanical and climatic test methods. Standard reliability testing methods of non-volatile memory devices
StatusCurrent
Publication Date09 September 2020
Normative References(Required to achieve compliance to this standard)EN 60749-23, JESD94, IEC 60749-23, IEC 60749-6, JESD47, EN 60749-6
Informative References(Provided for Information)JEDEC Standard 22-A117, JEP122H
International RelationshipsEN IEC 60749-41:2020,IEC 60749-41:2020
Draft Superseded By19/30350992 DC
DescriptorsMechanical testing, Electronic equipment and components, Test equipment, Electrical testing, Electric terminals, Shear testing, Vibration testing, Bonding, Low-pressure tests, Stress, Mass spectrometry, Pull-out tests, Thermal testing, Defects, Radioactive tracer methods, Semiconductor devices, Test specimens, Environmental testing, Specimen preparation, Fire tests, Visual inspection (testing), Dimensional measurement, Accelerated testing, Moisture measurement, Integrated circuits, Endurance testing, Storage, Classification systems, Leak tests, Damp-heat tests, Strength of materials, Thermal-shock tests, Testing conditions, Solderability testing, Marking, Torsion testing, Flammability, Temperature measurement
ICS31.080.01
Title in FrenchDispositifs à semiconducteurs. Méthodes d’essais mécaniques et climatiques Méthodes d’essai normalisées pour la fiabilité des dispositifs à mémoire non volatile
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Prüfverfahren Standardisierte Prüfverfahren für die Zuverlässigkeit von nichtflüchtigen Speicher-Bauelementen
CommitteeEPL/47
ISBN978 0 580 96287 5
PublisherBSI
FormatA4
DeliveryYes
Pages26
File Size1.121 MB
Price£186.00


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