PD IEC/TR 61189-3-914:2017 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines

PD IEC/TR 61189-3-914:2017

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines

Status : Current   Published : March 2017

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IEC TR 61189-3-914:2017(E) specifies the detailed procedures and precautions for IEC 61189-3-913.




Standard NumberPD IEC/TR 61189-3-914:2017
TitleTest methods for electrical materials, printed boards and other interconnection structures and assemblies. Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
StatusCurrent
Publication Date31 March 2017
Normative References(Required to achieve compliance to this standard)IEC 60194, EIA/JEDEC STD 51-2, IEC 61189-3-913, IEC 60068-1:2013
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsIEC TR 61189-3-914:2017
DescriptorsSolderability testing, Thermal testing, Mechanical testing, Printed-circuit boards, Dimensional measurement, Fire tests, Electrical testing, Environmental testing, Visual inspection (testing), Peeling tests, Reports, Printed circuits, Electronic equipment and components, Precision, Accuracy, Electrical insulating materials
ICS31.180
CommitteeEPL/501
ISBN978 0 580 94937 1
PublisherBSI
FormatA4
DeliveryYes
Pages28
File Size3.091 MB
Price£182.00


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