BS EN 60749-9:2017 - Semiconductor devices. Mechanical and climatic test methods. Permanence of marking

BS EN 60749-9:2017

Semiconductor devices. Mechanical and climatic test methods. Permanence of marking

Status : Current   Published : November 2017



IEC 60749-9:2017(E) is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.

This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test.

This edition includes the following significant technical changes with respect to the previous edition:

a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions;

b) additional variant – ‘adhesive tape pull test’.

Standard NumberBS EN 60749-9:2017
TitleSemiconductor devices. Mechanical and climatic test methods. Permanence of marking
Publication Date27 November 2017
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)IEC 61340-2-3:2016, EN 61340-2-3:2016, FED-STD-101C
ReplacesBS EN 60749-9:2002
International RelationshipsEN 60749-9:2017,IEC 60749-9:2017
Draft Superseded By16/30345063 DC
DescriptorsEnvironmental testing, Climate, Permanent, Mechanical testing, Integrated circuits, Semiconductor devices, Solvent-resistance tests, Marking, Non-destructive testing, Chemical-resistance tests, Electronic equipment and components
Title in FrenchDispositifs à semiconducteurs. Méthodes d'essais mécaniques et climatiques Permanence du marquage
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Prüfverfahren Beständigkeit der Kennzeichnung
ISBN978 0 580 94935 7
File Size831 KB

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