BS EN 60749-3:2017 - Semiconductor devices. Mechanical and climatic test methods. External visual examination

BS EN 60749-3:2017

Semiconductor devices. Mechanical and climatic test methods. External visual examination

Status : Current   Published : November 2017

Format
PDF

Format
HARDCOPY



IEC 60749-3:2017(E) is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.


This edition includes the following significant technical changes with respect to the previous edition:


a) reference to the need for ESD protection;


b) inclusion of information on the phenomenon of tin whiskers;


c) inclusion of an optional report form/checklist.






Standard NumberBS EN 60749-3:2017
TitleSemiconductor devices. Mechanical and climatic test methods. External visual examination
StatusCurrent
Publication Date24 November 2017
Normative References(Required to achieve compliance to this standard)EN 61340-5-1:2016, IEC 62483:2013, IEC 61340-5-1:2016
Informative References(Provided for Information)IEC 60749-9:2017, EN 60749-9:2017
ReplacesBS EN 60749-3:2002
International RelationshipsEN 60749-3:2017,IEC 60749-3:2017
Draft Superseded By16/30344800 DC
DescriptorsIntegrated circuits, Environmental testing, Mechanical testing, Climate, Electronic equipment and components, Semiconductor devices, External, Non-destructive testing, Visual inspection (testing)
ICS31.080.01
Title in FrenchDispositifs à semiconducteurs. Méthodes d'essais mécaniques et climatiques Examen visuel externe
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Prüfverfahren Äußere Sichtprüfung
CommitteeEPL/47
ISBN978 0 580 94893 0
PublisherBSI
FormatA4
DeliveryYes
Pages18
File Size929 KB
Price£130.00


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