BS EN 60749-6:2017 - Semiconductor devices. Mechanical and climatic test methods. Storage at high temperature

BS EN 60749-6:2017

Semiconductor devices. Mechanical and climatic test methods. Storage at high temperature

Status : Current   Published : November 2017

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IEC 60749-6:2017(E) is to test and determine the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied. This test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure methods and time-to-failure of solid state electronic devices, including non-volatile memory devices (data-retention failure mechanisms). This test is considered non-destructive but should preferably be used for device qualification. If such devices are used for delivery, the effects of this highly accelerated stress test will need to be evaluated. Thermally activated failure mechanisms are modelled using the Arrhenius equation for acceleration, and guidance on the selection of test temperatures and durations can be found in IEC 60749-43.


This edition includes the following significant technical changes with respect to the previous edition:


a) additional test conditions;


b) clarification of the applicability of test conditions.






Standard NumberBS EN 60749-6:2017
TitleSemiconductor devices. Mechanical and climatic test methods. Storage at high temperature
StatusCurrent
Publication Date24 November 2017
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)IEC 60749-43:2017, EN 60749-20:2009, IEC 60749-20:2008, EN 60749-43:2017
ReplacesBS EN 60749-6:2002
International RelationshipsEN 60749-6:2017,IEC 60749-6:2017
Draft Superseded By16/30344796 DC
DescriptorsHigh temperatures, Electronic storage, Semiconductor devices, Semiconductor storage, Climate, Integrated circuits, Environmental testing, Electronic equipment and components, Mechanical testing
ICS31.080.01
Title in FrenchDispositifs à semiconducteurs. Méthodes d'essais mécaniques et climatiques Stockage à haute température
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Prüfverfahren Lagerung bei hoher Temperatur
CommitteeEPL/47
ISBN978 0 580 94892 3
PublisherBSI
FormatA4
DeliveryYes
Pages12
File Size812 KB
Price£110.00


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