BS IEC 63055:2016 - Format for LSI-Package-Board interoperable design

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BS IEC 63055:2016

Format for LSI-Package-Board interoperable design

Status : Current   Published : November 2016

Format
PDF

Format
HARDCOPY



IEC 63055:2016(E) defines a common interoperable format that will be used for the design of


a) large-scale integration (LSI),


b) packages for such LSI, and


c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.




Standard NumberBS IEC 63055:2016
TitleFormat for LSI-Package-Board interoperable design
StatusCurrent
Publication Date30 November 2016
Cross ReferencesIEEE Std 1364, IEEE Std 1076-2008, IEC 62433-2, IEC 62433-3, IEC 62433-4, IEC 62433-5
International RelationshipsIEC 63055:2016
DescriptorsIntegrated circuits, Printed-circuit boards, Electromagnetic compatibility, Noise (spurious signals), Electronic equipment and components, Mathematical models, Simulation, Emission, Electromagnetic fields, Electrical conductance, Electric terminals
ICS31.180
31.200
35.060
CommitteeEPL/501
ISBN978 0 580 94227 3
PublisherBSI
FormatA4
DeliveryYes
Pages208
File Size9.109 MB
Price£330.00


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