PD IEC/TS 61189-3-301:2016 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB

PD IEC/TS 61189-3-301:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB

Status : Current   Published : August 2016

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IEC TS 61189-3-301:2016(E) outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold, nickel and copper plating in PWBs.




Standard NumberPD IEC/TS 61189-3-301:2016
TitleTest methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB
StatusCurrent
Publication Date31 August 2016
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsIEC/TS 61189-3-301 Ed.1.0
DescriptorsFire tests, Printed circuits, Electrical insulating materials, Environmental testing, Visual inspection (testing), Dimensional measurement, Electronic equipment and components, Printed-circuit boards, Electrical testing, Precision, Thermal testing, Mechanical testing, Solderability testing, Reports, Peeling tests, Accuracy
ICS31.180
CommitteeEPL/501
ISBN978 0 580 93803 0
PublisherBSI
FormatA4
DeliveryYes
Pages20
File Size2.307 MB
Price£130.00


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