ASTM F3139 - 15 - Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry

ASTM F3139 - 15

Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry

Status : Current   Published : May 2015

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1.1 This test method covers procedures for the analysis of tin-based solder alloys for minor and trace elements using inductively-coupled plasma atomic emission spectrometry (ICP-AES) instrumentation.

1.2 These test procedures were validated for the analytes and mass fractions listed below.

[This table has been removed.]

1.3 The procedures appear in the following order:

[This table has been removed.]

1.4 The values stated in SI units are to be regarded as the standard. Any other values are for information only.

1.5  This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.




Standard NumberASTM F3139 - 15
TitleStandard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry
StatusCurrent
Publication Date01 May 2015
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
Descriptors Antimony, Bismuth, Cadmium, Declarable substances, ICP-AES, Inductively coupled plasma atomic emission, spectrometry, Lead, Lead-free, Mercury, RoHS, SAC, Solder, Tin solder
ICS71.040.50
PublisherASTM
FormatA4
DeliveryYes
Pages8
File Size104 KB
Price£40.00


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