ASTM F3147 - 15 - Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend

ASTM F3147 - 15

Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend

Status : Current   Published : June 2015

Format
PDF

Format
HARDCOPY



1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility

1.2 A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).




Standard NumberASTM F3147 - 15
TitleStandard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend
StatusCurrent
Publication Date01 June 2015
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
Descriptors Bend, Conductive adhesive, Encapsulant, Land-pad, Mandrel, Printed flexible circuit, SMD, Staking compound
ICS31.220.20
PublisherASTM
FormatA4
DeliveryYes
Pages3
File Size130 KB
Price£36.00


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