BS EN IEC 61191-1:2018 Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

BS EN IEC 61191-1:2018

Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Status : Current, Under review   Published : November 2018

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What is this standard about?

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.




Standard NumberBS EN IEC 61191-1:2018
TitlePrinted board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
StatusCurrent, Under review
Publication Date13 November 2018
Normative References(Required to achieve compliance to this standard)IEC 61191-4, IPC-A-610, EN 61191-4, IEC 61191-2, EN 61190-1-1, IEC 61249-8-8, IEC 61340-5-1, EN 60068-2-58, IEC/TR 61340-5-2, IEC 60068-2-20, IEC 61189-1, CLC/TR 61340-5-2, IEC 61190-1-3, EN 61191-2, EN 61249-8-8, IEC 60721-3-1, IEC 61191-3, EN 61189-1, IEC 60068-2-58, EN 61191-3, IEC 61189-3, EN 60068-2-20, IEC 60194, EN IEC 60721-3-1, EN 61340-5-1, EN 61760-2, IEC 61760-2, EN IEC 61190-1-3, EN 61189-3, ISO 9001:2008, IEC 61190-1-1
Informative References(Provided for Information)J-STD-033, IEC 61188-5-6, EN 61188-5-5, EN 62326-1, IPC-SM-817, IEC 61188-5-2, EN 61189-2, IPC-9191, J-STD-003, IEC/PAS 62326-7-1, IEC 61189-2, IEC 61193-3, EN 61190-1-2, EN 62326-4, EN 61188-5-1, EN 61188-5-4, J-STD-005, EN 61193-1, J-STD-002, IPC-OI-645, IEC 61188-5-3, IEC 61189-5-502, IEC 61188-5-4, EN 61188-7, J-STD-006, IEC 61188-5-5, EN 61193-3, J-STD-004, IEC 62326-1, IEC 61188-7, IEC 61188-5-1, IEC 62326-4, EN 61188-5-2, J-STD-001, IEC 61190-1-2, EN 61188-5-3, J-STD-020, IPC-9202, EN 61188-5-6, IPC-TM-650, IEC 61193-1
ReplacesBS EN 61191-1:2013
International RelationshipsEN 62129-2:2011,EN IEC 61191-1:2018,IEC 61191-1:2018
Draft Superseded By15/30327712 DC
DescriptorsElectrical resistance, Soldering, Inspection, Components, Electrical components, Design, Quality assurance, Personnel, Fluxes (materials), Coating processes, Electronic equipment and components, Verification, Defects, Process control, Approval testing, Wettability, Printed circuits, Working conditions (physical), Printed-circuit boards, Integrated circuits, Ordering, Quality assurance systems, Conformity, Acceptance (approval), Joints, Flatness (surface), Surface mounting, Semiconductor devices, Assembling, Wires, Microassembling, Performance, Surface mounting devices, Cleaning, Visual inspection (testing), Contaminants, Assessed quality, Classification systems
ICS31.180
31.190
31.240
Title in FrenchEnsembles de cartes imprimées Spécification générique. Exigences relatives aux ensembles électriques et électroniques brasés utilisant les techniques de montage en surface et associées
Title in GermanElektronikaufbauten auf Leiterplatten Fachgrundspezifikation. Anforderungen an gelötete elektrische und elektronische Baugruppen unter Verwendung der Oberflächenmontage und verwandter Montagetechniken
CommitteeEPL/501
ISBN978 0 580 91108 8
PublisherBSI
FormatA4
DeliveryYes
Pages50
File Size1.376 MB
Price£240.00


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