BS EN 61189-5-4:2015 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

BS EN 61189-5-4:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

Status : Current   Published : January 2015

Format
PDF

Format
HARDCOPY



IEC 61189-5-4:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering.




Standard NumberBS EN 61189-5-4:2015
TitleTest methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
StatusCurrent
Publication Date31 January 2015
Normative References(Required to achieve compliance to this standard)IEC 61189-5, EN 61189-5, IEC 61189-6, EN 61189-6, IEC 61190-1-3, EN 61190-1-3
Informative References(Provided for Information)IEC 60068-2-20, EN 60068-2-20, IEC 61189-1, EN 61189-1, IEC 61189-2:2006, EN 61189-2:2006, IEC 61189-3:2007, EN 61189-3:2008, IEC 61190-1-1, EN 61190-1-1, IEC 61190-1-2, EN 61190-1-2, IEC 61249-2-7, EN 61249-2-7, IEC 62137:2004, EN 62137:2004, ISO 9001, EN ISO 9001, ISO 9455-2, EN ISO 9455-2, ISO 5725-2, ISO 9455-1, ASTM B-36, IPC-9201:1996, IPC-TR-467:1996
International RelationshipsEN 61189-5-4:2015,IEC 61189-5-4:2015
Amended ByCorrigendum, April 2015.
Draft Superseded By12/30274804 DC
DescriptorsPrinted circuits, Printed-circuit boards, Electronic equipment and components, Electrical insulating materials, Visual inspection (testing), Dimensional measurement, Chemical analysis and testing, Mechanical testing, Electrical testing, Environmental testing, Soldering, Fluxes (materials)
ICS31.180
Title in FrenchMéthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles. Méthodes d'essai générales pour les matériaux et les assemblages. Alliages à braser et brasages solides fluxés et non fluxés pour les assemblages de cartes imprimées
Title in GermanPrüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen. Allgemeine Prüfverfahren für Materialien und Baugruppen. Lotlegierungen und Lotdraht mit und ohne Flussmittel für bestückte Leiterplatten
CommitteeEPL/501
ISBN978 0 580 90020 4
PublisherBSI
FormatA4
DeliveryYes
Pages26
File Size1.322 MB
Price£182.00


 Your basket
Your basket is empty

Multi-user access to over 3,500 medical device standards, regulations, expert commentaries and other documents


BSOL

The faster, easier way to work with standards


Develop a PAS

Develop a fast-track standardization document in 9-12 months


Tracked Changes

Understand the changes made to a standard with our new Tracked Changes version