BS EN 61189-5-3:2015 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies

BS EN 61189-5-3:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies

Status : Current   Published : January 2015

Format
PDF

Format
HARDCOPY



IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.




Standard NumberBS EN 61189-5-3:2015
TitleTest methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies
StatusCurrent
Publication Date31 January 2015
Normative References(Required to achieve compliance to this standard)IEC 61189-5, IEC 61189-6, IEC 61190-1-2:2014, IEC 61190-1-3, EN 61189-5, EN 61189-6, EN 61190-1-2:2014, EN 61190-1-3
Informative References(Provided for Information)IEC 60068-1:2013, IEC 60068-2-20, IEC 61189-1, IEC 61189-2, IEC 61189-3, IEC 61190-1-1, IEC 61249-2-7, IEC 62137:2004, ISO 5725-2, ISO 9001, ISO 9455-1, ISO 9455-2, IPC-9201:1996, IPC-TR-467:1996, ASTM B-36, ASTM D-1210-79, EN 60068-1:2014, EN 60068-2-20, EN 61189-1, EN 61189-2, EN 61189-3, EN 61190-1-1, EN 61249-2-7, EN 62137:2004, EN ISO 9001, EN ISO 9455-2
International RelationshipsEN 61189-5-3:2015,IEC 61189-5-3:2015
Amended ByCorrigendum, April 2015.
Draft Superseded By12/30274800 DC
DescriptorsPrinted circuits, Printed-circuit boards, Electronic equipment and components, Electrical insulating materials, Visual inspection (testing), Dimensional measurement, Chemical analysis and testing, Mechanical testing, Electrical testing, Environmental testing, Soldering, Fluxes (materials)
ICS31.180
Title in FrenchMéthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles. Méthodes d'essai générales pour les matériaux et les assemblages. Pâte de brasage pour les assemblages de cartes imprimées
Title in GermanPrüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen. Allgemeine Prüfverfahren für Materialien und Baugruppen. Lotpaste für bestückte Leiterplatten
CommitteeEPL/501
ISBN978 0 580 90019 8
PublisherBSI
FormatA4
DeliveryYes
Pages46
File Size2.118 MB
Price£240.00


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