BS EN 62137-4:2014 - Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices

BS EN 62137-4:2014

Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices

Status : Current   Published : February 2015

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Standard NumberBS EN 62137-4:2014
TitleElectronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices
StatusCurrent
Publication Date28 February 2015
Normative References(Required to achieve compliance to this standard)IEC 60068-2-14, IEC 60191-6-2, IEC 60191-6-5, IEC 60194, IEC 62137-4:2014, IEC 61190-1-3, IEC 61249-2-7, IEC 61249-2-8, IEC 62137-3:2011, EN 60068-2-14, EN 60191-6-2, EN 60191-6-5, EN 60194, EN 61190-1-3, EN 61249-2-7, EN 61249-2-8, EN 62137-3:2012
Informative References(Provided for Information)IEC 60068-1:1998, IEC 60068-1:1998/AMD1:1992, IEC 60068-2-2, IEC 60068-2-6, IEC 60068-2-21:2006, IEC 60068-2-27, IEC 60068-2-44:1995, IEC 60068-2-58:2004, IEC 60068-2-78:2001, IEC 60749-1:2002, IEC 60749-20:2008, IEC 60749-20-1:2009, IEC 61188-5-8, IEC 61189-3:2007, IEC 61189-5, IEC 61190-1-1, IEC 61190-1-2, IEC 61760-1:2006, IEC 62137-1-3, IEC 62137-1-4:2009, EN 60068-1:1994, EN 60068-2-2, EN 60068-2-6, EN 60068-2-21:2006, EN 60068-2-27, EN 60068-2-44:1995, EN 60068-2-58:2004, EN 60068-2-78:2001, EN 60749-1:2003, EN 60749-20:2009, EN 60749-20-1:2009, EN 61188-5-8, EN 61189-3:2008, EN 61189-5, EN 61190-1-1, EN 61190-1-2, EN 61760-1:2006, EN 62137-1-3, EN 62137-1-4:2009
ReplacesBS EN 62137:2004
International RelationshipsEN 62137-4:2014,IEC 62137-4:2014
Amended ByCorrigendum, June 2015.
Draft Superseded By12/30271778 DC
DescriptorsElectronic equipment and components, Surface mounting devices, Integrated circuits, Printed-circuit boards, Soldered joints, Soldering, Solders, Environmental testing, Endurance testing, Mechanical testing, Thermal testing, Life (durability)
ICS31.190
Title in FrenchTechnique d'assemblage des composants électroniques. Méthodes d'essais d'endurance des joints brasés des composants pour montage en surface à boîtiers de type matriciel
Title in GermanMontageverfahren für elektronische Baugruppen. Oberflächenmontierbare Bauteilgehäuse mit Flächenmatrix. (Lebens-)Dauerprüfungen für Lötverbindungen
CommitteeEPL/501
ISBN978 0 580 89842 6
PublisherBSI
FormatA4
DeliveryYes
Pages48
File Size2.302 MB
Price£240.00


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