BS EN 61709:2017 - Electric components. Reliability. Reference conditions for failure rates and stress models for conversion

BS EN 61709:2017

Electric components. Reliability. Reference conditions for failure rates and stress models for conversion

Status : Current, Under review   Published : August 2017



IEC 61709:2017 is also available as

IEC 61709:2017 RLV

which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 61709:2017 gives guidance on the use of failure rate data for reliability prediction of electric components used in equipment. The method presented in this document uses the concept of reference conditions which are the typical values of stresses that are observed by components in the majority of applications. Reference conditions are useful since they provide a known standard basis from which failure rates can be modified to account for differences in environment from the environments taken as reference conditions. Each user can use the reference conditions defined in this document or use their own. When failure rates stated at reference conditions are used it allows realistic reliability predictions to be made in the early design phase. The stress models described herein are generic and can be used as a basis for conversion of failure rate data given at these reference conditions to actual operating conditions when needed and this simplifies the prediction approach. Conversion of failure rate data is only possible within the specified functional limits of the components. This document also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this document then additional information on the specified conditions can be dispensed with. This document does not provide base failure rates for components – rather it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition. The prediction methodology described in this document assumes that the parts are being used within its useful life. The methods in this document have a general application but are specifically applied to a selection of component types as defined in Clauses 6 to 20 and I.2. This third edition cancels and replaces the second edition, published in 2011. This edition constitutes a technical revision. This third edition is a merger of IEC 61709:2011 and IEC TR 62380:2004.

This edition includes the following significant technical changes with respect to the previous edition: addition of 4.5 Components choice, 4.6 Reliability growth during the deployment phase of new equipment, 4.7 How to use this document, and of Clause 19 Printed circuit boards (PCB) and Clause 20 Hybrid circuits with respect to IEC TR 62380; addition of failure modes of components in Annex A; modification of Annex B, Thermal model for semiconductors, adopted and revised from IEC TR 62380; modification of Annex D, Considerations on mission profile; modification of Annex E, Useful life models, adopted and revised from IEC TR 62380; revision of Annex F (former B.2.6.4), Physics of failure; addition of Annex G (former Annex C), Considerations for the design of a data base on failure rates, complemented with parts of IEC 60319; addition of Annex H, Potential sources of failure rate data and methods of selection; addition of Annex J, Presentation of component reliability data, based on IEC 60319.

Keywords: failure rate data, reliability prediction of electric components

Standard NumberBS EN 61709:2017
TitleElectric components. Reliability. Reference conditions for failure rates and stress models for conversion
StatusCurrent, Under review
Publication Date08 August 2017
Normative References(Required to achieve compliance to this standard)IEC 60050-192:2015
Informative References(Provided for Information)IEC 61703:2002, IEC 60721, ISO 13584, IEC 61360, IEC 62007, ISO 10303-31:1994, IEC 60721-3-3:1994 Cons Ed 2-2, IEC 60050-521:2002, IEC 61360-4:2005 DB, IEC 62741:2015, IEC 61710:2013, IEC 60300-3-5:2001, IEC 60050-151:2001, IEC PAS 62435:2005, IEC 61014:2003, IEC TR 61508-0:2005, ISO 10303-11:2004, IEC 62308:2006, IEC 61810-2:2011, IEC 61163-2:1998, IEC 60721-3-5:1997, IEC 61810-2-1:2011, IEC 61649:2008, IEC 60747-1:2006, IEC TR 60943:1998, IEC 60650, IEC 60300-3-3:2017, IEC 60747-12-2:1995, IEC 60300-3-2:2004, IEC 61812-1:2011, IEC TR 62380:2004, IEC 60721-3-4:1995, IEC 60721-3-7:1995 Cons Ed 2-1, IEC 60319:1999, IEC 61360-1:2009, BS IEC 60605-6:2007
ReplacesBS EN 61709:2011
International RelationshipsEN 61709:2017,IEC 61709:2017
Draft Superseded By15/30310531 DC
DescriptorsStress, Environment (working), Mathematical calculations, Semiconductor devices, Optoelectronic devices, Integrated circuits, Indicator lights, Relays, Diodes, Capacitors, Resistors, Transformers, Electric coils, Switches, Inductors, Reliability, Failure (quality control), Electronic equipment and components
Title in FrenchComposants électriques. Fiabilité. Conditions de référence pour les taux de défaillance et modèles de contraintes pour la conversion
Title in GermanBauelemente der Elektronik. Zuverlässigkeit. Referenzbedingungen für Ausfallraten und Beanspruchungsmodelle zur Umrechnung
ISBN978 0 580 87539 7
File Size2.426 MB

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