BS EN 61189-5-1:2016 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies

BS EN 61189-5-1:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies

Status : Current   Published : October 2016

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IEC 61189-5-1:2016 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as guidance documents and handbooks for printed board assemblies.




Standard NumberBS EN 61189-5-1:2016
TitleTest methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies
StatusCurrent
Publication Date31 October 2016
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)IEC 61189-5-502, IEC 60068-2-58:2015, IPC-6012, IEC 61189-5-5, EN 61189-5, IEC 60068, IPC-HDBK-840, IPC-7912, EN 61249-2-7, IPC-9501, IPC-A-610, IEC 61189-1, IPC-HDBK-001, IPC-AC-62A, EN 61190-1-1, IEC 61189-6, IEC 61189-5, EN 61189-5-1:2016, ISO 9001, IPC-JEDEC-9703, IPC-HDBK-830, IPC-9503, IPC-6013, IPC-9202, IPC-TM-650, EN 61189-6, IEC 61190-1-3, EN 60068-1:2014, EN 61190-1-3, EN ISO 9001, IPC-9261A, ISO 9455-1, EN 60068-2-20, IPC-9201, IPC-HDBK-610, EN 60068-2-58:2015, IEC 60068-2-20, IPC-SM-840, EN 29455-2, IPC-9641, IEC 61190-1-2, IPC-5702, IEC 61189-5-503:2017, ISO 5725-2, IEC 61189-5-1:2016, IPC-J-STD-020, ISO 9455-2, IPC-JEDEC-9704A, IPC-3406, IPC-9252, IPC-J-STD-001, IPC-9631, EN 61189-1, IEC 61189-5-3:2015, IEC 61189-5-501, IPC-9502, IEC 61190-1-1, IEC 61189-5-2:2015, EN 61189-5-3:2015, IPC-J-STD-005, IPC-CH-65A, IPC-A-610C, EN 61190-1-2, IEC 61189-5-504, IPC-9203, IEC 61249-2-7, IEC 60068-1:2013, IPC-5701, IPC-9504, IEC 61189-5-4:2015, EN 29455-1, IPC-B-52, IPC-6018, IEC 62137:2004, EN 61189-5-4:2015, IPC-9691A, EN 60068, EN 61189-5-2:2015, EN 62137:2004
International RelationshipsEN 61189-5-1:2016,IEC 61189-5-1:2016
Draft Superseded By14/30309692 DC
DescriptorsElectrical testing, Soldering, Printed circuits, Fluxes (materials), Environmental testing, Printed-circuit boards, Electronic equipment and components, Chemical analysis and testing, Dimensional measurement, Mechanical testing, Electrical insulating materials, Visual inspection (testing)
ICS31.180
Title in FrenchMéthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles. Méthodes d'essai générales pour les matériaux et assemblages. Lignes directrices pour les assemblages de cartes à circuit imprimé
Title in GermanPrüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen. Allgemeine Prüfverfahren für Materialien und Baugruppen. Leitfaden für Baugruppen von Leiterplatten
CommitteeEPL/501
ISBN978 0 580 87381 2
PublisherBSI
FormatA4
DeliveryYes
Pages32
File Size779 KB
Price£182.00


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