BS EN 62047-25:2016 - Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area

BS EN 62047-25:2016

Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area

Status : Current   Published : November 2016

Format
PDF

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HARDCOPY



IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.




Standard NumberBS EN 62047-25:2016
TitleSemiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
StatusCurrent
Publication Date30 November 2016
Normative References(Required to achieve compliance to this standard)IEC 62047-1, ISO 10012, EN 62047-1, EN ISO 10012
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 60745-2-8:2003/A11:2007,EN 62047-25:2016,IEC 62047-25:2016
Draft Superseded By06/30150799 DC14/30296140 DC
DescriptorsSemiconductor technology, Integrated circuits, Electronic equipment and components, Resonance, Electromechanical devices, Thin-film devices, Bend testing, Vibration, Test specimens, Fatigue testing, Test equipment, Semiconductor devices
ICS31.080.99
Title in FrenchDispositifs à semiconducteurs. Dispositifs microélectromécaniques. Technologie de fabrication de MEMS à base de silicium. Méthode de mesure de la résistance à la traction-compression et au cisaillement d'une micro zone de brasure
Title in GermanHalbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Siliziumbasierte MEMSHerstellungstechnologie. Messverfahren zur Zug-Druckund Scherfestigkeit gebondeter Flächen im Mikrometerbereich
CommitteeEPL/47
ISBN978 0 580 85615 0
PublisherBSI
FormatA4
DeliveryYes
Pages28
File Size2.298 MB
Price£186.00


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