Standard Number | BS EN 62047-26:2016 |
Title | Semiconductor devices. Micro-electromechanical devices. Description and measurement methods for micro trench and needle structures |
Status | Current, Under review |
Publication Date | 31 May 2016 |
Normative References(Required to achieve compliance to this standard) | No other standards are normatively referenced |
Informative References(Provided for Information) | ISO 3274:1996, ISO 129-1:2018, ISO/IEC Guide 98-3:2008, EN ISO 3274:1997, GUM:1995 |
International Relationships | EN 60793-2-30:2009,EN 62047-26:2016,IEC 62047-26:2016 |
Draft Superseded By | 06/30153373 DC14/30294910 DC |
Descriptors | Thin films, Semiconductor devices, Test equipment, Electronic equipment and components, Test specimens, Integrated circuits, Tensile testing, Semiconductor technology, Electromechanical devices |
ICS | 31.080.99
|
Title in French | Dispositifs à semiconducteurs. Dispositifs microélectromécaniques. Description et méthodes de mesure pour structures de microtranchées et de microaiguille |
Title in German | Halbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Beschreibung und Messverfahren für Mikro-Rillen und Nadelstrukturen |
Committee | EPL/47 |
ISBN | 978 0 580 85309 8 |
Publisher | BSI |
Format | A4 |
Delivery | Yes |
Pages | 34 |
File Size | 1.832 MB |
Price | £218.00 |