BS EN 62047-26:2016 - Semiconductor devices. Micro-electromechanical devices. Description and measurement methods for micro trench and needle structures

BS EN 62047-26:2016

Semiconductor devices. Micro-electromechanical devices. Description and measurement methods for micro trench and needle structures

Status : Current, Under review   Published : May 2016

Format
PDF

Format
HARDCOPY



IEC 62047-26:2016 specifies descriptions of trench structure and needle structure in a micrometer scale. In addition, it provides examples of measurement for the geometry of both structures. For trench structures, this standard applies to structures with a depth of 1 µm to 100 µm; walls and trenches with respective widths of 5 µm to 150 µm; and aspect ratio of 0,006 7 to 20. For needle structures, the standard applies to structures with three or four faces with a height, horizontal width and vertical width of 2 µm or larger, and with dimensions that fit inside a cube with sides of 100 µm. This standard is applicable to the structural design of MEMS and geometrical evaluation after MEMS processes.




Standard NumberBS EN 62047-26:2016
TitleSemiconductor devices. Micro-electromechanical devices. Description and measurement methods for micro trench and needle structures
StatusCurrent, Under review
Publication Date31 May 2016
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)ISO 3274:1996, ISO 129-1:2018, ISO/IEC Guide 98-3:2008, EN ISO 3274:1997, GUM:1995
International RelationshipsEN 60793-2-30:2009,EN 62047-26:2016,IEC 62047-26:2016
Draft Superseded By06/30153373 DC14/30294910 DC
DescriptorsThin films, Semiconductor devices, Test equipment, Electronic equipment and components, Test specimens, Integrated circuits, Tensile testing, Semiconductor technology, Electromechanical devices
ICS31.080.99
Title in FrenchDispositifs à semiconducteurs. Dispositifs microélectromécaniques. Description et méthodes de mesure pour structures de microtranchées et de microaiguille
Title in GermanHalbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Beschreibung und Messverfahren für Mikro-Rillen und Nadelstrukturen
CommitteeEPL/47
ISBN978 0 580 85309 8
PublisherBSI
FormatA4
DeliveryYes
Pages34
File Size1.387 MB
Price£214.00


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