ASTM D1867 - 13 - Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

ASTM D1867 - 13

Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

Status : Current   Published : January 2013

Format
PDF

Format
HARDCOPY



1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.3  This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.




Standard NumberASTM D1867 - 13
TitleStandard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
StatusCurrent
Publication Date11 January 2013
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
Descriptors Circuit board, Copper-clad laminate, Printed circuit board, Printed wiring board, Thermosetting laminate
ICS31.180
PublisherASTM
FormatA4
DeliveryYes
Pages5
File Size0 KB
Price£40.00


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