BS EN 61189-3-719:2016 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

BS EN 61189-3-719:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Status : Current   Published : April 2016

Format
PDF

Format
HARDCOPY



This part of IEC 61189 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.




Standard NumberBS EN 61189-3-719:2016
TitleTest methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
StatusCurrent
Publication Date30 April 2016
Normative References(Required to achieve compliance to this standard)IEC 60068-2-58:2015, IEC 60068-2-14, EN 60194, IPC-2221, EN 60068-2-14, EN 60068-2-58:2015, IEC 60194
Informative References(Provided for Information)IPC 2221A:2003
International RelationshipsEN 61189-3-719:2016,IEC 61189-3-719:2016
Draft Superseded By13/30293995 DC
DescriptorsElectrical insulating materials, Printed circuits, Fire tests, Precision, Reports, Mechanical testing, Accuracy, Environmental testing, Printed-circuit boards, Thermal testing, Dimensional measurement, Solderability testing, Visual inspection (testing), Electrical testing, Peeling tests, Electronic equipment and components
ICS31.180
Title in FrenchMéthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles. Méthodes d'essai pour les structures d'interconnexion (cartes imprimées). Contrôles de la variation de résistance des trous métallisés uniques (PTH) au cours des cycles thermiques
Title in GermanPrüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen. Prüfverfahren für Verbindungsstrukturen (Leiterplatten). Überwachung des Widerstands von Einzeldurchkontaktierungen (PTH - plated-through hole) bei Temperaturwechselbeanspruchung
CommitteeEPL/501
ISBN978 0 580 85142 1
PublisherBSI
FormatA4
DeliveryYes
Pages18
File Size1.552 MB
Price£130.00


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