ASTM D1151 - 00(2013) - Standard Practice for Effect of Moisture and Temperature on Adhesive Bonds

ASTM D1151 - 00(2013)

Standard Practice for Effect of Moisture and Temperature on Adhesive Bonds

Status : Current   Published : January 2013

Format
PDF

Format
HARDCOPY



1.1 This practice defines conditions for determining the performance of adhesive bonds when subjected to continuous exposure at specified conditions of moisture and temperature. The performance is expressed as a percentage based on the ratio of strength retained after exposure to the original strength.

1.2 The values stated in SI units are to be regarded as the standard. The values given in parentheses are provided for information purposes only.

1.3  This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.




Standard NumberASTM D1151 - 00(2013)
TitleStandard Practice for Effect of Moisture and Temperature on Adhesive Bonds
StatusCurrent
Publication Date10 January 2013
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
Descriptors Adhesive bonds, Moisture, Temperature
ICS83.180
PublisherASTM
FormatA4
DeliveryYes
Pages3
File Size0 KB
Price£36.00


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