BS EN IEC 60191-1:2018 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices

BS EN IEC 60191-1:2018

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices

Status : Current   Published : April 2018

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IEC 60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.


This edition includes the following significant technical changes with respect to the previous edition:


a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8;


b) a definition of the term "stand-off" has been added;


c) the methods for locating the datum have been extended to be suitable for SMD-packages;


d) the visual identification of terminal position one for automatic handling has been clarified;


e) the rules for the drawing of terminals have been clarified;


f) Table A.1 has been completed with symbols specifically for SMD-packages;


g) Annex B "Standardization philosophy" has been deleted;


h) a normative Annex with special rules for SMD-packages has been added;


i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.

 




Standard NumberBS EN IEC 60191-1:2018
TitleMechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices
StatusCurrent
Publication Date30 April 2018
Normative References(Required to achieve compliance to this standard)IEC 60191-6-3, IEC 60191-4, IEC 60191-6-20, IEC 60191-6-21, IEC 60191-2, IEC 60191-6-1
Informative References(Provided for Information)ISO 263, IEC 60191-6 (all parts), ISO 3705, ISO 261, ISO 5459:2011
ReplacesBS IEC 60191-1:2007
International RelationshipsEN IEC 60191-1:2018,IEC 60191-1:2018
Draft Superseded By13/30290462 DC
DescriptorsConversion (units of measurement), Technical drawing, Interchangeability, Drawings, Standardization, Electric terminals, Dimensional tolerances, Engineering drawings, Dimensions, Rounding (numbers), Numerical designations, Electronic equipment and components, Semiconductor devices
ICS31.080.01
Title in FrenchNormalisation mécanique des dispositifs à semi-conducteurs Règles générales pour la préparation des dessins d'encombrement des dispositifs discrets
Title in GermanMechanische Normung von Halbleiterbauelementen Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von Einzelhalbleiterbauelementen
CommitteeEPL/47
ISBN978 0 580 84425 6
PublisherBSI
FormatA4
DeliveryYes
Pages44
File Size1.74 MB
Price£214.00


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