BS EN 61189-2-721:2015 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator

BS EN 61189-2-721:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator

Status : Current   Published : June 2015

Format
PDF

Format
HARDCOPY



IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.




Standard NumberBS EN 61189-2-721:2015
TitleTest methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
StatusCurrent
Publication Date30 June 2015
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 60904-2:2007,EN 61189-2-721:2015,IEC 61189-2-721:2015
Draft Superseded By13/30287604 DC
DescriptorsTesting conditions, Printed-circuit boards, Blistering, Electrical resistivity, Flow measurement, Peeling tests, Test specimens, Pull-out tests, Electronic equipment and components, Thermal testing, Printed circuits, Plastics, Impregnated materials, Compressible flow, Accuracy, Volatile matter determination, Determination of content, High-temperature testing, Electrical testing, Chemical analysis and testing, Electric arcs, Gelation, Cleaning, Electrodes, Chemical-resistance tests, Precision, Position, Sodium hydroxide, Electrical insulating materials, Test equipment, Time, Resistance measurement, Thermal-shock tests
ICS31.180
Title in FrenchMéthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles. Méthodes d'essai des matériaux pour structures d'interconnexion. Mesure de la permittivité relative et de la tangente de perte pour les stratifiés recouverts de cuivre en hyperfréquences à l'aide d'un résonateur diélectrique en anneaux fendus
Title in GermanPrüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen. Prüfverfahren für Verbindungsstrukturen (Leiterplatten). Messung der relativen Permittivität und des Verlustfaktors von kupferkaschiertem Laminat im Mikrowellen- Frequenzbereich unter Verwendung eines Split Post dielektrischen Resonators
CommitteeEPL/501
ISBN978 0 580 83821 7
PublisherBSI
FormatA4
DeliveryYes
Pages28
File Size1.809 MB
Price£182.00


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