PD IEC/TS 62647-3:2014 - Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Performance testing for systems containing lead-free solder and finishes

PD IEC/TS 62647-3:2014

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Performance testing for systems containing lead-free solder and finishes

Status : Current   Published : March 2014

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IEC TS 62647-3:2014(E) defines for circuit card assemblies a default method for those companies that require a pre-defined approach, and a protocol for those companies that wish to develop their own test methods. The intent of this document is to aid avionics/defence suppliers in satisfying the reliability and/or performance requirements of IEC/TS 62647-1 as well as support the expectations in IEC/TS 62647-21. The default method is intended for use by electronic equipment manufacturers, repair facilities, or programs that may be unable to develop methods specific to their own products and applications. It should be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing lead-free (Pb-free) solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of avionics electronic equipment.




Standard NumberPD IEC/TS 62647-3:2014
TitleProcess management for avionics. Aerospace and defence electronic systems containing lead-free solder. Performance testing for systems containing lead-free solder and finishes
StatusCurrent
Publication Date31 March 2014
Normative References(Required to achieve compliance to this standard)IPC-9701A:2006, IPC-SM-785, JESD22-B110A, MIL-STD-810G:2008, IEC/TS 62647-22:2013
Informative References(Provided for Information)IEC/TS 62647-21, 2002/95/EC, IEC/TS 62647-2, 2011/65/EU, IPC/JEDEC-9703, GEIA-STD-0005-1, GEIA-STD-0005-2, GEIA-HB-0005-2, IEC 62137-3, IEC/TS 62647-1:2012, MIL-HDBK-217F:1991, GEIA-HB-0005-1, IEC 62137-1
ReplacesDD IEC/PAS 62647-3:2011
International RelationshipsIEC/TS 62647-3:2014
DescriptorsSolders, Aircraft components, Defence, Lead alloys, Soldering, Air transport engineering, Performance testing, Production management, Lead-free alloys, Fluxes (materials), Environmental testing, Printed-circuit boards, Finishes, Repair, Electronic equipment and components, Printed circuits
ICS03.100.50
31.020
49.060
CommitteeGEL/107
ISBN978 0 580 83707 4
PublisherBSI
FormatA4
DeliveryYes
Pages46
File Size877 KB
Price£240.00


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