ASTM F1995 - 13 - Standard Test Method for Determining the Shear Strength of the Bond between a Surface Mount Device (SMD) and Substrate in a Membrane Switch

ASTM F1995 - 13

Standard Test Method for Determining the Shear Strength of the Bond between a Surface Mount Device (SMD) and Substrate in a Membrane Switch

Status : Current   Published : January 2013

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PDF

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HARDCOPY



1.1 This test method covers the determination of the shear integrity of materials and procedures used to attach surface mount devices (SMD) to a membrane switch circuit.

1.2 This test method is typically used to indicate the sufficient cure of conductive adhesive or underfill, or both. In general, this test method should be used prior to encapsulant. This test may also be used to demonstrate the Shear Force with encapsulation.

1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

1.4  This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.




Standard NumberASTM F1995 - 13
TitleStandard Test Method for Determining the Shear Strength of the Bond between a Surface Mount Device (SMD) and Substrate in a Membrane Switch
StatusCurrent
Publication Date05 January 2013
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
Descriptors Adhesion, Bond strength, LED, Membrane switch, Shear force, SMD, Surface mount
ICS31.220.20
PublisherASTM
FormatA4
DeliveryYes
Pages2
File Size0 KB
Price£36.00


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