PD IEC/TR 62866:2014 - Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
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PD IEC/TR 62866:2014

Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

Status : Current   Published : May 2014

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PDF

Format
HARDCOPY



IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.




Standard NumberPD IEC/TR 62866:2014
TitleElectrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
StatusCurrent
Publication Date31 May 2014
Cross ReferencesIEC 60068-1, IEC 60068-2-2, IEC 60068-2-30, IEC 60068-2-38, IEC 60068-2-66, IEC 60068-2-67, IEC 60068-2-78, IEC 60068-3-5, IEC 60068-3-6, IEC 60194, IEC 60749-4, ISO 4677-1, ISO 9455, ISO 9455-17, ANSI/ASQ Z1.4, ANSI/ASQ Z1.9, ANSI J STD 004, EIAJ ED-4701/100, EIAJ ED-4701/102, EIAJ D-4701/301, IPC J-STD-004, IPC-TM-650, IPC-TR-476A, IPC-9201A, IPC-SM-840, JESD22-A101, JESD22-A102-C, JESD22-A110, JESD22-A110-B, JESD22-A113, JPCA BU 01, JPCA DG 02, JPCA ET 01, JPCA ET 06, JPCA ET 08, JPCA ET 09, JTM K 01, JTM K 07, MIL-HDBK-781A, MIL-STD-690
International RelationshipsIEC TR 62866:2014
DescriptorsPackaging materials, Electric conductors, Electrical insulation, Printed wiring, Finishes, Electric contacts, Packaging, Adhesive strength, Metal coatings, Printed circuits, Assembling, Flammability, Printed-circuit bases, Design, Electric current, Electrical connections, Position, Thickness, Heat loss, Protective coatings, Fire safety, Printed-circuit boards, Angles (geometry), Layout, Coated materials, Voltage, Electronic equipment and components, Holes, Dimensions, Electrical resistance, Patterns
ICS31.180
Title in FrenchMigration électrochimique dans les cartes a circuits imprimés et assemblages. Mécanismes et essais
CommitteeEPL/501
ISBN978 0 580 83339 7
PublisherBSI
FormatA4
DeliveryYes
Pages96
File Size3.106 MB
Price£264.00


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