BS EN 60191-6-13:2016 - Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

BS EN 60191-6-13:2016

Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Status : Current   Published : December 2016

Format
PDF

Format
HARDCOPY



IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:


a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.




Standard NumberBS EN 60191-6-13:2016
TitleMechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
StatusCurrent
Publication Date31 December 2016
Normative References(Required to achieve compliance to this standard)IEC 60191-2, IEC 60191-6, EN 60191-6
Informative References(Provided for Information)No other standards are informatively referenced
ReplacesBS EN 60191-6-13:2007
International RelationshipsEN 60191-6-13:2016,IEC 60191-6-13:2016
Draft Superseded By13/30284025 DC
DescriptorsSymbols, Packages, Technical drawing, Engineering drawings, Integrated circuits, Dimensions, Standardization, Semiconductor devices, Printed-circuit boards, Designations, Drawings, Electronic equipment and components
ICS31.080.01
Title in FrenchNormalisation mécanique des dispositifs à semiconducteurs. Guide de conception pour les supports sans couvercle pour les boîtiers matriciels à billes et à pas fins (FBGA) et les boîtiers matriciels à zone de contact plate et à pas fins (FLGA)
Title in GermanMechanische Normung von Halbleiterbauelementen. Konstruktionsleitfaden für Open-top-Fassungen für Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (FBGA/FLGA)
CommitteeEPL/47
ISBN978 0 580 83163 8
PublisherBSI
FormatA4
DeliveryYes
Pages24
File Size832 KB
Price£182.00


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